The QFN packaging, which has been available for GaAs technology for several years, is now also available for GaN technology (GH25 & GH15).
Optimize Handling and Mounting of Your GaN MMICs
We are proud to announce the full release of the device packaging service for our GaN technologies GH25 and GH15. Through this offer, you can receive your own MMICs designed on our technologies in a plastic molded SMD package. The packaging platform is fully qualified for QFN 4x4 up to 7x7.
Cost-Effective and Easy-to-Use Solution
This economic packaging provides our customers with a simple solution for handling and mounting devices on boards and equipment in less constraining environments compared to naked die handling. Already available for GaAs technologies for several years, we extend this service starting today to our GaN technologies.
Comprehensive Support From Design to Assembly
Naturally, we provide our foundry customers with the PDKs and associated documentation to consider electrical effects of the package during the design phase and apply the specific assembly rules.
This after a video that explains everything you need to know about this new release.