Thales has published an article on the European Pampa project.
This project is concerned with the realisation of low cost, “plastic based” microwave units as candidates for future generations of telecom satellites. The advanced technology developed in this project will be used in satellite payloads and consists of Plastic encapsulation of the electronic components Surface Mount Technology for a collective assembly of the components on a Printed Circuit Board.
Thales Alenia Space is leading the project with following project partners: Ikor Technology (Spain), IMEC (Belgium), Sencio (Netherlands) and UMS (France).
UMS has been selected for its experience as an MMIC supplier and expertise in RF plastic package device supplier.