Project SMART3: UMS, in collaboration with Fraunhofer IZM and TU Berlin, wins Best Academic Paper Award of EPTC2025

The team of UMS, Fraunhofer IZM and TU Berlin received the award notification earlier this month.

Paper title:

“Seamless Heterointegration of Components: Advancements in Fanout Technology and Thermal Solutions in System in Package”

Paper Abstract:

The advent of fan-out technology has revolutionized the integration of various chip front-end technologies within a single package, offering significant advantages in performance and efficiency. By enabling a more compact design and improved signal integrity, fan-out technology facilitates the seamless interconnection of diverse semiconductor components, particularly within System-in-Package (SiP) architectures. This paper explores the benefits of fan-out technology, with a particular focus on approaches for enhanced thermal management, reduced form factor, and increased functionality through the integration of antenna structures. Furthermore, its pivotal role in the heterogeneous integration and the associated reliability aspects within SiP solutions is discussed, thereby paving the way for advanced applications in the rapidly evolving landscape of electronics.

Authors:

Gernhardt, Robert –  Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  

Adler, Marius  – Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  

Braun, Tanja   – Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  

Wöhrmann, Markus – Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  

Lambert, Benoît – United Monolithic Semiconductors

Riedl, Jesse C. – United Monolithic Semiconductors

Ganesh, Ulrike – TU Berlin

Schneider-Ramelow, Martin – TU Berlin