Foundry
Shared Foundry Runs
Test your Innovative Circuits with
our Proven Technologies
Shared foundry runs or Multi-Project Wafers (MPW) are a cost effective foundry approach well suited for Institutes, Labs, Research Centers and Universities. This service allows different customer projects on a single wafer.
You will be able to:
- Try new designs with high performance processes at limited cost
- Design MMICs not available on the market place with perfect system fit & cost savings
- Ensure business protection with secured IP & product exclusivity
- Participants have free access to Design Kits. 20 diced & untested MMICs in Gel-Pak® box will eventually be delivered.
Next MPW Runs
UMS shared foundry runs offer regular Multi Project Wafer runs with information 6 months notice before tape-out.
The possible die length and width, including dicing streets, are:
| For high power process PPH15X | For Low noise and multi-purpose processes PH25, PH10, BES | For passive process ULRC | For GaN processes |
| 1.4 mm 2 mm 2.4 mm 3.4 mm 4 mm 4.4 mm | 1 mm 1.4 mm 2.4 mm 3.4 mm 4 mm | 1.4 mm 2 mm 2.4 mm 3.4 mm 4 mm | 1 mm 2 mm 3 mm 4 mm |
| With maximum aspect ratio 1:3 | With maximum aspect ratio 1:3 | With maximum aspect ratio 1:4 | With maximum aspect ratio 1:4 |
| Die size includes a 70 µm dicing street | Die size includes a 70 µm dicing street | Die size includes a 70 µm dicing street | Die size includes a 100 µm dicing street |
Price is determined according to die area and process.
MPW Offer per technology
2025 GaN Hemt process runs
Condition of Sales
UMS General Conditions of Sales
If you are interested in our Shared Foundry runs or if you have wishes, please fill in the below questionary.
Shared Foundry Runs
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