Shared foundry runs

Shared foundry runs or Multi-Project Wafers are a cost effective foundry approach well suited for Institutes, Labs, Research Centers and Universities. This service allows different customer projects on a single wafer.

You will be able to:

  • Try new designs with high performance processes at limited cost
  • Design MMICs not available on the market place with perfect system fit & cost savings
  • Ensure business protection with secured IP & product exclusivity

Participants have free access to Design Kits.  20 diced & untested MMICs in Gel-Pak® box will eventually be delivered.

The possible die length and width, including dicing streets, are:

For high power processes PPH25X, PPH15X:

  • 1.4mm
  • 2mm
  • 2.4mm
  • 3.4mm
  • 4mm
  • 4.4mm

with maximum aspect ratio 1:3

For Low noise and multi-purpose processes PH25, PH15, PH10, PPH25, HB20M, HP07, BES

  • 1mm
  • 1.4mm
  • 2.4mm
  • 3.4mm
  • 4mm

with maximum aspect ratio 1:3

For passive proces ULRC

  • 1.4mm
  • 2mm
  • 2.4mm
  • 3.4mm

 

Price is determined according to die area and process.

 

Next MPW runs

UMS shared foundry runs offer regular Multi Project Wafer runs with information 6 months notice before tape-out.

Shared foundry runs 2021

Shared foundry runs 2021 planning

 Next low-medium power process runs

Next High Power Process run:

Next Schottky diode process run

Next Passive process run

Next GaN Hemt process runs

Condition of sales

Shared runs are scheduled based on customer needs. UMS optimize schedule to meet tape-out date that maximize delivery time agreement with customers.

If you are interested by one of the Shared Foundry runs proposed in 2021, please fill in the questionnaire below: